Mechanically flexible and one-dimensional electronic interconnects are nowadays a standard, enabling various applications, and offering a wide range of advantages. Taking planar one-dimensional flexible systems onto the next level of high-speed and high performance electronic systems, various efforts on connecting rigid integrated circuits (ICs), e.g. microcontrollers, batteries, sensors, actuators etc., to flexible interconnects exist. In this work, a comprehensive surface mount technology (SMT) for rigid and silicon dioxide based ICs onto flexible and glycol-modified Polyethylene Terephthalate screen-printed interconnects is developed. Here, the SMT solution addresses the following challenges: low thermal budget of Polyethylene Terephthalate, non-solderability of the screen-printed structures, aluminum coating of the IC, and small-sized pitches of the IC. Besides, various reliability aspects of the assembled electrical end product are investigated.